Unavailability of Exposed pad for STM32L031x4/6 in UFQFPN28 package
There is a note for UFQFPN32 package, that says "There is an exposed die pad on the underside of the UFQFPN package.", But there is no similar statement for UFQFPN28 package for the same device. Is it intentional or missed or if there is any plan to ...