STM32F103RCT6烧毁
早上好!在装机生产中STM32F103RCT6芯片能正常工作,成品机器交付客户使用后出现STM32F103RCT6芯片烧毁损坏的情况。成品机器与客户端通讯接口内信号线是直接连接芯片I/O口,客户端与成品机器联合使用,当成品机器出线异常(后排查为STM32F103RCT6芯片烧毁),客户端未出现芯片烧毁的情况。相关直连引脚为【PB3】&【PB4】,PB3做输出I/O量,PB4做输入I/O量。请问该芯片烧毁的原因可能是哪些?
早上好!在装机生产中STM32F103RCT6芯片能正常工作,成品机器交付客户使用后出现STM32F103RCT6芯片烧毁损坏的情况。成品机器与客户端通讯接口内信号线是直接连接芯片I/O口,客户端与成品机器联合使用,当成品机器出线异常(后排查为STM32F103RCT6芯片烧毁),客户端未出现芯片烧毁的情况。相关直连引脚为【PB3】&【PB4】,PB3做输出I/O量,PB4做输入I/O量。请问该芯片烧毁的原因可能是哪些?
Error observed: From dmesg: tpm tpm0: tpm_try_transmit: send(): error -62OS Version:5.15.71TPM Chip: ST33KTPM2XI2CConnectivity: CPU->I2C-> TPM2.0Driver: https://github.com/STMicroelectronics/TCG-TPM-I2C-DRV/tree/5.10.yStep to reproduce the issueExerc...
Hi,I am using the Bluenrg-332ac and the eval board BlueNRG-LPS STEVAL-IDB012V1. I used the 'hci_le_connectionless_iq_report_event' function to extract IQ signals and RSSI. However, the magnitude, which is derived from the IQ samples, fluctuates dram...
This is a question about a TPM IC, if this is the wrong channel please advise as to correct channel. The question relates to the Linux driver for the ST33TPHF2XI2C.Setup:Driver Verion - unlnown - downloaded from GITHUB 06-JUN-2022.IC as ordered: ST3...
Hello!I have been trying to run the example codes from BLE_examples. It works well on BlueNRG_Navigator GUI. Unfortunately, It throws this error to every projects I try to run and deug on WISE-Studio. What must be the problem that causes this error? ...
Hello,I configured the s2-lp csma as follow: xCsmaPersistentMode = S_DISABLE xMultiplierTbit = CSMA_PERIOD_128TBIT xCcaLength = 1 cMaxNb = 2 nBuCounterSeed = 0xFA21 cBuPrescaler = 2 I set the rssi threshold at -82 dBm, If the channel is free, it list...
Hello,I am integrating the BlueNRG-2 module (BlueNRG-M2SA) in a development with an STM32L496VGT6 processor.Currently I cannot communicate with the BLueNRG module.I have done all the tests of my code with the STEVAL-STWINKT1 module, and the minimum c...
Hi.Currently we use SIM7000G and SIM7070G (GSM, NB-IoT, LTE-M, GNSS) modules from Simcom in our projects, using for authentication only a SIM holder with plastic chip, in the old way. We are starting to integrate the eSIM ICs on the boards, to use ho...
Hi team, kindly assist us with below mentioned queries..For the some ST Microcontroller components Datasheet did not specify Thermal characteristics such as junction-case or junction-board thermal resistance. we need these values for the thermal simu...
We transitioned from BLUENRG-M0L to BLUENRG-M2SP. We did some basic application testing with the X-NUCLEO-BNRG2A1 platform, and we had the example application up and running seamlessly.However, we’ve encountered an issue when integrating the BLUENRG-...