L298P Thermal Resistance Value
I'm looking for the Thermal Resistance from junction to board for the PowerSO20. Do you have this information?
I'm looking for the Thermal Resistance from junction to board for the PowerSO20. Do you have this information?
Need help with identifying the right TVS diode for load dump protection of our device. The test standard is MIL-STD-1275E which has 28V nominal working voltage with Ri = 0.5 ohm. The surge has a pulse duration of 50ms, Us = 100V, 5 number of pulses w...
I'm modeling and inserting an IGBT element called STGW60H65DFB into PSIM to analyze switching loss, conduction loss, etc. However, there is not enough information on the body diode in the data sheet, so I would like to ask if I can get it from ST.All...
Hi,Generated delay of 1 Microsecond in NUCLEO-F410RB board by using Timer1(16bit) with counter but while using Timer(16bit) interrupt mode unable to generate 1 Microsecond delay,even the Pre-scaler,Counter and Clock frequency are at required rate(Cou...
Dear team, Please provide the A8 bit value of the following EEPROM M24C04-FMC6TG. Regards, Kaushal
Dear all,I need to the CMRT_Rev.6.31(Conflict Minerals Reporting Template) document.Best regard,Manamu Fukahori / SISTEC
Hello,i am currently testing the vl53l5cx lidar sensor without a coverglass, but i will need soon to use a coverglass(dusty environment). When using the coverglass, can the vl53l5cx (with Xtalk calibration) still detect object at close range(from 2cm...
Currently have the VL53V0X, Need a sensor that maintains high accuracy within the short distance as well as the long distance, speed is also a priority. I understand the Vl53L5CX has the multi zone distance sense, does it also work well as a single o...
Hi, I am having issue using a M24512RP in the exact same place as a M24512RT (I am talking of marking code on the chip). I2C EEPROM.From the datasheet it seems that 'T' suffixe is used to identify packing which would make sense for an ordering code, ...
Is there anywhere I can find the solder paste recommendations for the POWERSTEP01? The footprint appears complex and we would like guidance on the recommended solder paste deposit sizes and stencil thickness for production assembly purposes.