I am using STM32H745ZIT6 device in my design .want to do thermal analysis for the particular part . what is the power dissipation of the device and how to do?

Pchal.1 · ‎2020-12-11

TDK · ‎2020-12-11

Power dissipated is voltage times current (for the current used within the device). Current will vary depending on what your chip does. The datasheet includes thermal characteristics of the package.

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Amel NASRI · ‎2021-01-04

Hi @Pchal.1 ,

Best Wishes for this New Year!

I assume that you can find an answer to your question in AN5036 ( Thermal management guidelines for STM32 applications).

It provides recommendations for efficient thermal analysis on STM32 applications like how to optimize thermal dissipation.

As example, a thermal analysis has been done on a Discovery kit with a STM32H747XI device (STM32H747I-DISCO) and results are shared in this document.

-Amel

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