There is a note for UFQFPN32 package, that says "There is an exposed die pad on the underside of the UFQFPN package.", But there is no similar statement for UFQFPN28 package for the same device. Is it intentional or missed or if there is any plan to add if it is intentional?
This note concern only the UFQFPN48 and the UFQFPN32. The UFQFPN28 package is not concerned by the exposed pad so this note is not applicable in this case.
Best Regards.
STTwo-32
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This note concern only the UFQFPN48 and the UFQFPN32. The UFQFPN28 package is not concerned by the exposed pad so this note is not applicable in this case.
Best Regards.
STTwo-32
To give better visibility on the answered topics, please click on Accept as Solution on the reply which solved your issue or answered your question.
