Posted on November 07, 2016 at 13:51This is primarily a user forum, if you want official answers you'll need to push in via your distributor and FAEs.
The document is from over 2 years ago, ST has in the past created SKU for parts destined for China, and also down rated die into less capable parts to meet volume or pricing goals. There looked to equivalent parts with alternative SKU
I would be wary of the 10 year commitment, from ST and others, packaging is often out-sourced, and wafer fabs get decommissioned (natural disaster, sale, bankruptcy, obsolete equipment failure, etc). The might result in different die, stepping, or packaging being substituted. Given the rate of EoL products over recent years, I would anticipate a reasonably complex project might require a board respin every several years to use current parts, or most cost effective ones.
