Regarding the thermal data for the parts.

[rohitgaikwad2702]

Hi team, 
Kindly assist us the below mentioned queries.

For the some ST microelectronics part data sheet, can not specify the thermal parameter such as junction to case 
thermal resistance and junction to board thermal resistance. we need those values for the thermal simulation.
so, can you please provide these data as soon as possible.
the part series number, I mentioned below: 

1) ST890DTR
2) BCP56-16
3) SMAJ5.0A-TR
4) SMAJ15A-TR
5) STL13N60DM2
6) TS924AIPT
7) STTH4R02U
😎 SM6T200CA

Looking for your soonest response.

[Andrew Neil]

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@rohitgaikwad2702 wrote:

For the some ST microelectronics part data sheet, can not specify the thermal parameter such as junction to case 

1) ST890DTR

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What's this, then:

[rohitgaikwad2702]

Hello, 
Datasheet specify junction-ambient thermal resistance, but we need the
value of junction-case thermal resistance and junction-board thermal resistance.

Thank you. 

Looking for your soonest response.

[Andrew Neil]

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@rohitgaikwad2702 wrote:

Datasheet specify junction-ambient thermal resistance, but we need the
value of junction-case

---

Surely, that's the same thing?

[AScha.3]

You have to read the datasheets yourself and calculate thermal resistance, depending on copper area you put there.

And from ds you see some typical value:

[rohitgaikwad2702]

Hi, 

No! junction-ambient thermal resistance and junction-case thermal resistance is two different things.

[AScha.3]

>You have to read the datasheets yourself and calculate thermal resistance, depending on copper area you put there.

Did you ?