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Regarding the thermal data for the parts.

rohitgaikwad2702
Associate II

Hi team, 
Kindly assist us the below mentioned queries.

For the some ST microelectronics part data sheet, can not specify the thermal parameter such as junction to case 
thermal resistance and junction to board thermal resistance. we need those values for the thermal simulation.
so, can you please provide these data as soon as possible.
the part series number, I mentioned below: 

1) ST890DTR
2) BCP56-16
3) SMAJ5.0A-TR
4) SMAJ15A-TR
5) STL13N60DM2
6) TS924AIPT
7) STTH4R02U
8) SM6T200CA

Looking for your soonest response.

6 REPLIES 6
Andrew Neil
Evangelist III

@rohitgaikwad2702 wrote:

For the some ST microelectronics part data sheet, can not specify the thermal parameter such as junction to case 

1) ST890DTR


What's this, then:

AndrewNeil_0-1712052574820.png

 

rohitgaikwad2702
Associate II

Hello, 
Datasheet specify junction-ambient thermal resistance, but we need the
value of junction-case thermal resistance and junction-board thermal resistance.

Thank you. 

Looking for your soonest response.


@rohitgaikwad2702 wrote:

Datasheet specify junction-ambient thermal resistance, but we need the
value of junction-case


Surely, that's the same thing?

You have to read the datasheets yourself and calculate thermal resistance, depending on copper area you put there.

And from ds you see some typical value:

AScha3_0-1712060544636.png

 

If you feel a post has answered your question, please click "Accept as Solution".

Hi, 

No! junction-ambient thermal resistance and junction-case thermal resistance is two different things.

 

>You have to read the datasheets yourself and calculate thermal resistance, depending on copper area you put there.

Did you ?

If you feel a post has answered your question, please click "Accept as Solution".