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Hi,I am using:STM32U575VGT6Q STM32CubeIDE 2.1.1 STM32Cube FW U5 V1.9.0 X-CUBE-FREERTOS 1.6.0 / FreeRTOS 11.2 TrustZone enabled FreeRTOS running in NonSecure (TZ_Non_Secure) FreeRTOS Secure support enabled (TZ_Secure)The generated NonSecure project fails at link time with:undefined reference to `SecureContext_AllocateContext'undefined reference to `SecureContext_LoadContext'undefined reference to `SecureContext_FreeContext'undefined reference to `SecureContext_SaveContext'undefined reference to `SecureContext_Init'undefined reference to `SecureInit_DePrioritizeNSExceptions'Some of them are followed by:Unknown destination type (ARM/Thumb)dangerous relocation: unsupported relocationThe NonSecure linker correctly links:Secure/Debug/secure_nsclib.obut CubeMX did not copy the required Secure FreeRTOS source files into the generated project:secure_context.csecure_context_port.csecure_heap.csecure_init.cOnly the corresponding .h files were copied under:Middlewares/Third_Party/FreeRTOS/Source/p

Hello,I am designing a wall-mounted touchscreen panel using a VL53L1CB for wake-up and person/presence detection at approximately 2–3 metres. High absolute distance accuracy is not required, but detection must be reliable without frequent false triggers.The sensor will be mounted behind a single 0.70 mm cover glass. I have read AN5231 Rev. 2 and UM2133.The proposed optical construction is:Single-layer 0.70 mm cover glass Sensor mounted parallel to the glass Air gap kept at or below approximately 0.30 mm, if mechanically possible Full-height black gasket/light barrier between the Tx and Rx sides Separate clear apertures for Tx and Rx in the black printing/coating Target transmission above 87% at 940 nm and haze below 1% at 940 nm Crosstalk and offset calibration performed after final assemblyThe first production batch will consist of 15 mechanically identical units.I would appreciate clarification on the following points:AN5231 recommends a cover-glass thickness below 0.6 mm, an air gap

Hardware and software MCU: STM32F411CEU6 Board: WeAct Black Pill V3.0 IDE: STM32CubeIDE 2.2.0 Programming tool: STM32CubeProgrammer 2.21.0 Host OS: Windows 11 Application: Existing application built as an ELF and BIN file (approximately 69.11 KB) Current programming method: JTAG/SWD, which works correctly Board reference: https://stm32-base.org/boards/STM32F401CEU6-WeAct-Black-Pill-V3.0.html#Reset-buttonThe reference page describes the F401 version of the board; my board uses the STM32F411CEU6.ObjectiveI want to program a fixed application binary (.bin) directly using STM32CubeProgrammer over USB DFU or UART, using the STM32's factory-programmed system-memory bootloader.I am not developing a custom bootloader or implementing field firmware updates. The same application currently programs and runs correctly through JTAG/SWD.1. USB DFU behaviourI enter system-memory boot mode by holding BOOT0, pressing and releasing NRST, and then releasing BOOT0.Windows detects the device th

It says one: But there’s two marked as ‘new’: 

Hi!I’m using this commangst-launch-1.0 -v  filesrc location=bbb.mp4 !  qtdemux ! h264parse !  v4l2slh264dec !   waylandsink fullscreen=trueTo play video in 1080p without lagging. But this comes without sound.How can I play sound with gst-launch-1.0?I can only play sound with “aplay /path/to/file.wav”.

Hello everyone! 👋I am new to STM32 development and recently started learning how to program STM32 microcontrollers using STM32CubeIDE. I created a simple project, but I am having trouble connecting my development board to the debugger.I am not sure whether I missed a configuration step or if there is a problem with the USB connection or debug settings. Since I am still learning, I would appreciate some guidance on how to troubleshoot this issue. 😊❓ Error / IssueWhen I try to start a debugging session, STM32CubeIDE does not seem to detect my board correctly. Sometimes the debugging process fails to start, and I am unsure what to check next. ⚠️ 🙏 My Questions Is there any additional driver I need to install? How can I check whether the ST-LINK debugger is detected correctly? Are there any beginner-friendly steps to verify the board and debug configuration? I would really appreciate any advice. I am just getting started with STM32 and would love to learn how to solve this

As far as I can tell from the naming, this is the file which is supposed to cover both the non-suffixed and J-suffixed STM32C552Rxx. However, I can’t see any, e.g. mention of the PE2..PE5 pins which are present for the J-suffix.I still would very much like to see the ‘C5 family covered also by the “old style” xml in the Open pin data.JW

Hi,I'm trying to program a blank STM32H573 through the embedded system bootloader over I2C4, but the bootloader does not respond.SetupBlank flash, product state Open, BOOT0 = 1 (measured at the MCU pin), board power-cycled Host: Aardvark I2C master at 100 kHz, address 0x65 (per AN2606) No debugger, USB or UART connectedResultLines idle high, but 0x65 is NACKed A full scan from 0x00 to 0x7F gets no ACKQuestionsAN2606 lists I2C4 on PD12/PD13. Does the bootloader use only those pins, or also other I2C4 pins such as PB8/PB9? Is BOOT0 = 1 enough on a blank device, or is STiROT involved in this boot path?Thanks.

Hi everyone, I am encountering an issue with the STM32G0B1RCTB microcontroller, specifically related to the "errata" concerning its dual-bank memory architecture.My project uses firmware structured as follows: a bootloader located at the beginning of the flash (0x08000000), an application located at 0x08006000, and a CRC data section—generated during the post-build process to ensure firmware integrity—placed at the end of the flash (0x0803F000).I need to keep the prefetch feature enabled; however, due to a known issue inherent to this microcontroller, the system crashes once the firmware exceeds a certain size.To resolve this, I decided to modify the option bytes to set the device to "single-bank" mode, which would allow me to keep the prefetch feature enabled.However, when the microcontroller resets (triggered by `FLASH->CR |= FLASH_CR_OBL_LAUNCH;`) to apply the new option bytes, the bootloader executes correctly (as it is located at the start of the flash), but the jump to the app

Hi!I'm trying to developing a Qt6 QML application with Vulkan support. But I having some issues. Can ST Dev Team give me an example of an Qt6 QML application that use Vulkan? It must work on STM32MP257. It will be a reference. I think I having wrong code settings on my Qt6 QML application. For OpenGL, it works. But not for Vulkan.Thank you!

Hai, I am trying to read the data stored in the EEPROM via I²C during the U-Boot SPL stage.The EEPROM data can be read successfully from both U-Boot and user space, as shown below. Uboot Area:iWave-G62H>iWave-G62H> i2c dev 0Setting bus to 0iWave-G62H> i2c md 0x50 0x0000.2 10000: 99    .iWave-G62H> i2c md 0x50 0x0000.2 10000: 99    .iWave-G62H> i2c mw 0x50 0x0000.2 0x01 1iWave-G62H>iWave-G62H> i2c md 0x50 0x0000.2 1     0000: 01    .iWave-G62H> i2c md 0x50 0x0000.2 10000: 01    .iWave-G62H> User Space:root@imx91-iwg62h:~#root@imx91-iwg62h:~# dd if=/sys/bus/i2c/devices/0-0050/eeprom bs=1 count=1 2>/dev/null | hexdump -C00000000  01                                                |.|00000001root@imx91-iwg62h:~#root@imx91-iwg62h:~#root@imx91-iwg62h:~# printf '\x99' | dd of=/sys/bus/i2c/devices/0-0050/eeprom bs=1 count=1                                                                                                                         1+0 records in1+0 recor

We are developing a new board based on the STM32H573.  We want to incorporate both Wi-Fi and BLE support, so adding the ST67W611M1 seems a logical fit.  Digging into CubeMX, it appears that the ST67W relies on a FreeRTOS + lwIP solution, at least for the T02 architecture.  (I would prefer not to use the T01 architecture, as it’s considerably more flexible to have the lwIP API in the host MCU.)  However, we also want to incorporate Ethernet support, and if one wants an out-of-the-Cube(MX) solution for Ethernet, all the provided examples are for ThreadX + NetX Duo.  We recently completed a design with the H563 and Ethernet using ThreadX and NetX Duo, so I’m familiar with that solution.I did see the post about using STM32H5 with lwIP, so I know it’s something that can be done.  Is using FreeRTOS + lwIP the best solution for supporting both Ethernet and Wi-Fi on STM32, since there doesn’t seem to be an out-of-the-box solution for Wi-Fi using ThreadX + NetX Duo?  FWIW, I don’t need to have

​Hello together,my Problem ist that I can find randomly (a few times per hour) timestamps which are delayed by 1ms, after that the delays consist and kind of add up. The cause for this is probably the SysTick_Handler firing 2x in a row and increasing my Uptime_ms timestamp. But here the extended information: I have a STM32H7 connected to a ADC via SAI. As I want precise time measurements my Code for capturing the time in the SAI_IRQ is the following: { uint32_t primask = __get_PRIMASK(); __disable_irq(); SAI_isr_systick = SYSTICK_VALUE; SAI_isr_uptime_ms = hfwtmr_Uptime; __set_PRIMASK(primask); // restore PRIMASK state}with:#define SYSTICK_VALUE (SysTick->VAL)volatile int64_t hfwtmr_Uptime = 0;volatile int64_t SAI_isr_uptime_ms = 0;volatile uint32_t SAI_isr_systick = 0; For setting up the Systick HAL_InitTick() is used. As the STM32H7 is running with 480MHz the systick gets loaded to 480000 every time. A screenshot auf the call hierarchy is added after the code segmen

Hi, does VL53L4ED support a programmable FoV? I am looking for a ToF sensor with extended temperature range, but require a narrower FoV and range up to ~2000mm.Thanks!-BH

I have a project which could use both OCTOSPI RAM and Flash but I also need an OCTO or Quad SPI port for a high speed ADC.It is unclear whether OCTOSPIM_Px_NCS1,2 can be configured to allow the memory to share one OCTOSPI portand, if so, how to do it.  It is entirely possible that I am missing something but I would appreciate input on the topic.Thanks. 

New question split from this post.HiThank you for your response. Unfortunately, our PCB is already in the prototype phase and we need to find a solution to power up the board for at least some basic testing.Then, on STM32H725REV6, are both Direct SMPS and Bypass (external VCORE on VCAP, VDDSMPS tied to VSS, PWR_EXTERNAL_SOURCE_SUPPLY) officially supported supply configurations?BRGilberto

Hi ST Community, I discovered nucleo board 2 weeks ago because I want build spectrometer using a Toshiba TCD1304DG CCD sensor.I’m reaching out because I need your help understanding how to drive this ccd sensor. I’ve read datasheet and projects on internet to get a general understanding of how to operate this sensor. However, there are a few points I’m still unsure about. Could you please help me clarify the following questions? Here is the datasheet : https://toshiba.semicon-storage.com/info/TCD1304DG_Web_Datasheet_en_20260520.pdf?did=13709&prodName=TCD1304DG 1. Is my understanding of the acquisition sequence correct?My understanding is that, to read all 3,694 pixels using a hardware timer, the ADC, and DMA, the acquisition sequence should be as follows: Set ICG LOW. After 500 ns, set SH HIGH. After 5,000 ns, set SH LOW. After another 5,000 ns, set ICG HIGH. Read all 3,694 pixels from the OS pin. The master clock (M) runs continuously, shifting the pixel values out sequentially, w

I am trying to configure IEEE 802.15.4 packet sniffing on a NUCLEO-WB55 using STM32CubeMonitor-RF and Wireshark.I flashed the following firmware: Wireless coprocessor (M0+): stm32wb5x_Mac_802_15_4_fw.bin from STM32Cube_FW_WB_V1.24.0 Application (M4): Mac_802_15_4_Sniffer_Nucleo.bin from STM32CubeMonitor-RF IssueThe sniffer is detected successfully as a USB Virtual COM Port, and Wireshark recognizes it as an STM32CubeMonitor-RF 802.15.4 sniffer.However, no packets are captured, even when transmitting IEEE 802.15.4 frames from another STM32WB board.Troubleshooting Performed Tested both USB and ST-LINK/SWD connections. Verified USB device and serial port detection. Verified Python, PySerial, and Wireshark compatibility. Confirmed Wireshark recognizes the sniffer interface through extcap. Tested direct capture using stm32cubeMonRf_sniffer.py. Tested capturing through Wireshark and STM32CubeMonitor-RF. Configured matching IEEE 802.15.4 channels. Verified that the transmitter

I believe I’ve encountered an Issue with the current version of the STM32 HAL2 and wanted to raise an issue, but I’m not sure where best to raise the issue.The one of the new features in the new HAL2 hash is that HAL_HASH_Update can handle input sizes that don’t perfectly line up with the block size, using HASH_SaveRemainingBytes to save any excess bytes at the end of a call and then calling HASH_AppendLastIncompleteWord at the next call to write those excess bytes to peripheral along with using some bytes from the new buffer to bulk it up to 4. This means that I can write something like: (where the buffer is 163 bytes long)HAL_HASH_Update(&hhash, &u8InputBuffer[0], 10,0xFFFF);HAL_HASH_Update(&hhash, &u8InputBuffer[10], 10,0xFFFF);HAL_HASH_Update(&hhash, &u8InputBuffer[20], 1,0xFFFF);HAL_HASH_Update(&hhash, &u8InputBuffer[21], 62,0xFFFF);HAL_HASH_Update(&hhash, &u8InputBuffer[83], 7,0xFFFF);HAL_HASH_Update(&hhash, &u8InputBuffer[90], 73,0

The MCU STM32G031K8T6 has the BOOT pin is in the same pin as the SYS_SWDIO. Should I just disregard the BOOT pin and allocate the function to SYS_SWDIO? I am not sure what is the function from the BOOT pin... the internet says:“Flash Memory Boot (Normal Operation): When the BOOT pin is pulled low (to ground), the microcontroller boots from its internal main flash memory, running the primary user application. [1, 2] System Memory Boot (Firmware Updates / ISP): When the BOOT pin is pulled high (to VCC), the chip bypasses user flash and boots into a factory-installed, read-only bootloader in system memory. This allows you to program or update the chip's firmware via serial interfaces like UART, USB, SPI, or I2C without needing an external hardware programmer. [1, 2]” The Nucleo (Nucleo NUCLEO-G031K8 Eval Kit) schematic for the G03 MCU does uses SYS_SDIO (the T_JTCK),and depopulates the pull down resistor from BOOT.Will my board NOT run my code automatically UNLESS I pull that resistor dow

Our board contains a STM32H523 and a W25Q256JV connected to OctoSPI1 configured for Quad SPI mode. FileX/LevelX should handle the external memory.LevelX OSPI Component is configured for “Custom”. After generating the code with CubeMX (6.18.1), Filex/Target/lx_stm32_ospi_driver_glue.c contains several functions with wrong code, e.g: INT lx_stm32_ospi_get_status(UINT instance) {…/* Initialize the read status register command */s_command.OperationType = HAL_XSPI_OPTYPE_COMMON_CFG;s_command.IOSelect = HAL_XSPI_SELECT_IO_7_0;s_command.Instruction = LX_STM32_OSPI_OCTAL_READ_STATUS_REG_CMD;s_command.InstructionMode = HAL_XSPI_INSTRUCTION_8_LINES;s_command.InstructionWidth = HAL_XSPI_INSTRUCTION_16_BITS;s_command.Address = 0;s_command.AddressMode = HAL_XSPI_ADDRESS_8_LINES;s_command.AddressWidth = HAL_XSPI_ADDRESS_32_BITS;s_command.AlternateBytesMode = HAL_XSPI_ALT_BYTES_NONE;s_command.DataMode = HAL_XSPI_DATA_8_LINES;s_command.DataLength = 2;s_command.DummyCycles = LX_STM32_OSPI_DUMMY_CYCLES_

Can I attach a hand-wound enamelled copper wire coil (about 0.05 to 0.1 mm wire) directly to the AC0 and AC1 pads of the UFDFPN5 package, with the chip mounted pads-up and the wire joined using solder or conductive epoxy, and no PCB? Is there any ST guidance or reliability concern with this?

Hi,  we use on a design a ISM6HG256X. We want to detect a shock end event using the interrupt INT2.We use this configuration :    * INT2_HG_WU = 0    * INT1_HG_WU = 0    * INT2_HG_SHOCK_CHANGE = 1     * INT1_HG_SHOCK_CHANGE = 0Logically, we should have an interrupt INT2 only when the shock event end is detected. In fact, we have an interrupt at wake_up event and at the shock end and sometimes we have interrupt on INT1. We use a STEVAL - MKI248KA to evaluate the ISM6.Do you have some tips to solve this problem?

HelloWe are currently using the ASM330LHH in our product and conducting ATP (Acceptance Test Procedure). During the thermal cycling/temperature test phase of the ATP, we have observed significant fluctuations and instability in the sensor outputs.To resolve this issue, we are considering migrating to the ASM330LHHXG1.While we have already reviewed the standard datasheets for both parts, we would like to request additional engineering insights or internal test data regarding their temperature stability. Specifically, we would appreciate your guidance on the following:Does the ASM330LHHXG1 feature any hardware, packaging, or calibration improvements that provide better thermal stability or lower thermal drift compared to the standard ASM330LHH? Have there been any reported cases or internal ST data showing that the ASM330LHHXG1 delivers more stable and repeatable results under stressful temperature environments like ATP? Beyond the datasheet specifications, are there any specific PCB lay

Rather than having to select my IDE every time I create a new Project, it would be nice to be able to set my own default.Similarly for other settings; eg, I always like to have the generated code as .c + .h file pairs.