STM32F301K8U6 thermal pad connect to GND?

song · ‎2015-10-08

Posted on October 08, 2015 at 11:07

I checked the datasheet and couldn't find the information whether the thermal pad should be connected to board ground, although another engineer told me it is very common to do so. Would anyone please advise whether or not the thermal pad on STM32F301K8U6 should be connected to board ground? Where can I find the information about it?

Amel NASRI · ‎2015-10-13

Posted on October 13, 2015 at 16:56

Hi David_Lin,

Although I don't understand what do you mean exactly by ''thermal pad'' on the STM32F301, I recommend you have a look to

http://www.st.com/st-web-ui/static/active/en/resource/technical/document/application_note/DM00070391.pdf

(Getting started with STM32F3 series hardware development). I hope it will bring you some help.

-Mayla-

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waclawek.jan · ‎2015-10-13

Posted on October 13, 2015 at 18:50

Mayla,

the ''U'' designator in part number means UFQFPN (a variant of QFN, i.e. leadless side-pin quad package). Look at Figure 45 of the datasheet (http://www.st.com/st-web-ui/static/active/en/resource/technical/document/datasheet/DM00093332.pdf ). Thermal pad is the metal square at the center of bottom of package.

Usually, datasheets of other chips in this package assign it a number and explicitly state whether it should be left unconnected or connected (usually to GND). I can't find this vital information in this datasheet nor in AN4206 you've mentioned, either.

Jan