The device in question is a STM32F030F4P6. I want to know if there is any risk of programming a device before sending it through a reflow oven (lead free soldering temperatures). We do this on other devices without issue, but I'm not certain if this is actually ok to do.
As long as your reflow follow the JEDEC standard, no issues to expect on your user Flash.
Some additional Flash area already store factory settings or code (bootloader/Calib values) and they aren't impacted by reflow.