Hi,
Please suggest STM32L562 UFBGA-132 Fanout guidelines.
I looked into STM32L562E-DK design files for fanout, in which signals are routed in top and S1 layer but there is not via details for layer transition from top to S1. Here attached the fanout for U7 of eval board.
Drill for U7
Top Layer layout for U7
Sig 1 layer layout for U7.
Regards,
Aman
Hi
According to the PCB file of STM32L562E-DK, the via between top layer and S1 layer blind via, whose diameter is 0.25mm while hole size is 0.1mm.
Normally, the signals at first circle and second circle of BGA are fan out on top layer, third and forth circle are fan out through first inner layer.
You can find PCB files of STM32L562E-DK on ST website: https://www.st.com/content/ccc/resource/technical/layouts_and_diagrams/board_manufacturing_specification/group1/0b/5b/4f/1f/cc/49/44/6a/mb1373_bdp/files/mb1373_bdp.zip/jcr:content/translations/en.mb1373_bdp.zip
Best Regards.
