In the LPS22HB datasheet , there is a statement " The package is holed to allow external pressure to reach the sensing element." Is there a hole somewhere in the part package that should not be covered up, and should be kept clear of obstructions?
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‎2023-02-13 9:07 AM
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‎2023-02-13 6:40 PM
Usually if the hole is not done on the plastic package, it is very small on the silicon exposed cap area of the package. Pressure doesn't need a "big" hole. Humidity sensors do as humidity is like a cloud, needs movement... a fan ideally.
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‎2023-02-13 5:51 PM
This is a good question. I went to google and looked at the images of some of these sensors. I didn't see any crazy obvious holes in the package. But based on what is typical for these types of pressure sensors and what I saw. I believe it is likely on the top where the window is.
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‎2023-02-13 6:40 PM
Usually if the hole is not done on the plastic package, it is very small on the silicon exposed cap area of the package. Pressure doesn't need a "big" hole. Humidity sensors do as humidity is like a cloud, needs movement... a fan ideally.
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‎2023-02-14 7:54 AM
Hi,
@S.Ma​ is right, you can have a look to this picture
-Eleon
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‎2023-02-14 8:36 AM
Thanks for the information. These are extremely small diameter holes barely seen under my microscope. So I assume the MEMs diaphragm is somewhere in the cavity below the "silver foil" cover with the 6 holes? ( I originally maybe wrongly assumed that the silver foil was not holed and was the diaphragm that flexed with changes in the atmosphere pressure).
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‎2023-02-14 8:46 AM
Hi @TSemk.1​ ,
correct (the silver foil is actually a silicon cap)
-Eleon
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