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Is there a good resource for understanding the differences with UFQFPN vs UFBGA? I would like to know the pros and cons with each and when to use one versus the other.

JGree.16
Associate II
 
2 REPLIES 2
Sco
ST Employee

The size of a BGA package is always smaller, and the path of signals could be shorter, it is good for the performance. But with a BGA package, the component is harder to reuse... before reusing it, you need some tools to handle the component, like Reballing.

The escape is more complicated, via-in-pad also requires more expensive finishing processes, ie fill and planarization

You should probably discuss with your manufacture/assembly people, and also determine acceptable board costs/expectations.

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