2021-11-01 09:01 AM
2021-11-01 08:13 PM
The size of a BGA package is always smaller, and the path of signals could be shorter, it is good for the performance. But with a BGA package, the component is harder to reuse... before reusing it, you need some tools to handle the component, like Reballing.
2021-11-01 08:45 PM
The escape is more complicated, via-in-pad also requires more expensive finishing processes, ie fill and planarization
You should probably discuss with your manufacture/assembly people, and also determine acceptable board costs/expectations.