STM32H753VI thermal dissipation calculation

[Manikandan]

Hi Team,

We are performing thermal simulation where the part STM32H753VI included in my board.

We are powering STM with 3V3 and we would like to understand the below parameters,

1)Tj,

2)Thermal simulation data if any

3) Efficiency to calculate the power dissipation?

Also, we could see some document An5036: section 6.1.1,table 4: we would like to understand how you calculated the dissipation values? Note: we aware the document is for different STM from ours.

Your prompt support on this will be highly appreciated !

Regards,
Manikandan R.

[ELABI.1]

Hi @Manikandan,

For your first question, the term Tj refers to the junction temperature, which is the maximum internal temperature that the core of the microcontroller can reach during operation. It is calculated as follows:

TJ max = TA max + (PD max × ΘJA)

For your third question, power dissipation is the amount of electrical energy converted into heat. This dissipation is important because it affects the internal temperature and is calculated as follows:

PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH)

You can refer to the STM32H753 Datasheet, specifically section 8.10 "Thermal Characteristics," where these formulas are well explained:

But for question 2) Thermal simulation data if any, I don't understand your question, could you please explain it to me in more detail?

Thanks.

ELABI.1