STM32H753VI thermal dissipation calculation

[Manikandan]

Hi Team,

We are performing thermal simulation where the part STM32H753VI included in my board.

We are powering STM with 3V3 and we would like to understand the below parameters,

1)Tj,

2)Thermal simulation data if any

3) Efficiency to calculate the power dissipation?

Also, we could see some document An5036: section 6.1.1,table 4: we would like to understand how you calculated the dissipation values? Note: we aware the document is for different STM from ours.

Your prompt support on this will be highly appreciated !

Regards,
Manikandan R.

[Amel NASRI]

Hi @Manikandan ,

Please refer to the section "Thermal characteristics" in the product datasheet to understand more about the Tj calculation: 

ΘJA is provided in the tables following this section and depends on the package used.

Regarding simulation data: No specific data is available for the STM32H753VI. However, the approach described in AN5036 for the STM32H747XI is applicable.

Your reference documents are as follows: 

• AN5036 - Thermal management guidelines for STM32 32-bit Arm Cortex MCUs applications: Table 4 in this document shows power dissipation versus Tj for the STM32H747XI, which can be adapted for similar devices.
• AN5337 - Guidelines for estimating STM32H7 MCUs lifetime: Offers insights into lifetime usage estimates based on voltage scaling and junction temperature.

If you require more details or specific simulation data, contact your FAE.

-Amel

[ELABI.1]

Hi @Manikandan,

For your first question, the term Tj refers to the junction temperature, which is the maximum internal temperature that the core of the microcontroller can reach during operation. It is calculated as follows:

TJ max = TA max + (PD max × ΘJA)

For your third question, power dissipation is the amount of electrical energy converted into heat. This dissipation is important because it affects the internal temperature and is calculated as follows:

PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH)

You can refer to the STM32H753 Datasheet, specifically section 8.10 "Thermal Characteristics," where these formulas are well explained:

But for question 2) Thermal simulation data if any, I don't understand your question, could you please explain it to me in more detail?

Thanks.

ELABI.1