2015-01-21 10:27 AM
Hello there!
I need to develop the device which has to sustain heavy mechanical shocks (a peak of 10 000g). I am going to use
http://www.ti.com/product/MSP430F5438A-EP
STM32F405RG. What level of mechanical shock can it sustain? I didn’t find such information in the datasheet. What packages (LQFP, UFBGA, WLCSP) is the most suitable for such applications?Thank you in advance for any help.
Artem
2015-01-21 11:09 AM
I'd imagine most of the mass and stress would come from the lead frame and how you've attached it to the board.
The use case is probably outside the normal, you'd likely want to discuss this with your local ST representative, or FAE, and determine if it's a supported application, and how much of your own expertise/validation will be required.2015-01-22 11:52 AM
Can you provide more details about the application?
If you need to quickly inspect and repair the equipment on the field, QFP is the only choice. BGA inspection requires highly specialized equipment and personel. X-ray imaging machines are used in production lines. Lead free soldering is more fragile than leaded soldering. However, leaded solder is allowed only on specific applications such as military equipment.2015-01-26 06:09 AM
Hi Artem,
As suggested by Clive1, please contact your FAE or local ST representative in order to discuss your requirement.-Mayla-To give better visibility on the answered topics, please click on Accept as Solution on the reply which solved your issue or answered your question.