Hi,
I am reviewing the Safety Manual to utilize the Self-Test Library provided by ST, and I have questions about the RAM Test method.
It is mentioned that STL provides RAM Test using the March C-algorithm, and its verified diagnostic coverage can satisfy 'Medium (90%)'.
I want to develop a product targeting SIL3 of IEC 61508, and if the HFT is structured to satisfy 1, there will be no problem in claiming SIL3 even if the DC is 'Medium (90%)'.
According to Table A.6 of IEC 61508-2 that I checked, the maximum diagnostic coverage that can be achieved with the simple march algorithm is confirmed to be 'Low'. I am curious as to how DC was verified as 'Medium (90%)' in STL.
If there is anything I misunderstand, please give me feedback.
