Dear STM,
I am a student and currently working on the lifetime estimation of an IGBT for my research, which involves a Finite-Element simulation on STGF7NB60SL IGBT.
To run the simulation, I need to know the material properties of different layers in the IGBT such as young's modulus, coefficient of thermal expansion, density, thermal conductivity and so on of each layer (Silicon chip, copper leadframe, solder joints, encapsulation...). Since there are many different material properties depending on the material composition of the layer, I would like to know what values of material properties are used for this IGBT.
I appreciate your attention to this post.
Sincerely,
