2023-11-08 03:48 AM
I have M27C64A-15F1 and M27C64A-15F1L, does anyone know what the difference is?
The L suffix doesn't appear anywhere on the datasheet and I can't find any info on it ?
2023-11-08 05:37 AM
Good question, I don't see this in the ordering scheme here, or for other of the M27C series.
Apt to be a Die Shrink or Second Source, or Production Plant. I don't think it will be consequential as nothing is flagging up in searching.
Perhaps Tube vs Tape-n-Reel modes of delivery.
2023-11-08 05:52 AM
Thank you, @Tesla DeLorean for bringing this to my attention.
The EPROMs have been discontinued for a very long time, so there is no more information available and I can only assume: I have never seen such a suffix L, but even if the L had a meaning (subjunctive), there were very likely no technical differences.
I hope this helps anyway?
Regards
/Peter
2023-11-08 05:56 AM
Thanks for your replies, this is the part. I have other parts with the L suffix ??
2023-11-08 05:56 AM
Sorry without the L suffix !
2023-11-08 06:09 AM - edited 2023-11-08 06:12 AM
I've seen too. I would look at the die size, bond wires, and ceramic / quartz housing, and production location. Could also relate to the lead frames, metal or tinning. Looking through materials here I couldn't see it called out across dozens of docs and data books.
Around this time ST, Intel and AMD all made very similar parts and had partnerships. There was always a strong push to shrink the die so more parts would fit on a wafer, so it was not unusual for the parts to change but retain form-and-function.