Hi @NMale.1 ,
there are some reason for a non-zero g level at application level.
During the production, the device is calibrated in stand-alone condition, and the steady output is typically 0g (or 1g when along z axis).
But when you solder the device on a board, you have to consider that the soldering is almost never fully planar, so that you will have a residual tilt due to this fact.
As reported in the datasheet at p. 16:
Offset is to some extent a result of stress to MEMS sensor and therefore the offset can slightly change after mounting the sensor onto a printed circuit board or exposing it to extensive mechanical stress. Offset changes little over temperature, see Table 4 “Zero-g level change vs. temperature�? (TCOff). The zero-g level tolerance (TyOff) describes the standard deviation of the range of zero-g levels of a population of sensors
For this reason, a good practice is to measure the offset in the stationary position of the application board, store it in a software variable and the apply (sum or subtract)) the found value during the signal processing.
-Eleon
