This is NGK. We would like to introduce bonded wafer for MEMS. Please help which Email address should l send ?

[#1]

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-NGK’s unique technology “Bonding of different materials “ realize high performance MEMS Wafer

-For instance, bonded Silicon and LiTaO3 or LiNbO3or or any material for MEMS

-Precise control of thickness by NGK polishing process enhances the performance of bonded wafer.

[Eleon BORLINI]

Hi @Shiro.1​ ,

you can send more details to my email address (I'll share it with you in the "Message" section, top right of the page) so that we can internally address your solutions with more focus.

-Eleon