2020-06-15 1:51 AM
2020-06-15 7:14 AM
Hi @JPlan.1 , the LSM6DSLTR top-side package marking is structured as described below (starting from the "pin 1" circular marking):
XX --> the part number identifier (for example SF)
Matrix code --> basically the device ID, it contains info about the chip wafer ID, the assy lot, the assy date
YWW --> "Y" is the last number of the assembly year, while "WW" stands for the year week number. For example, "646" means week 46 of 2016.
Regards