About DPrid.1

DPrid.1 · 2021-10-25

STM32G0B1 MCU, System Viewer file STM32G0xx_DFP\1.3.0\CMSIS\SVD\STM32G0B1.SVD: The file does not contain a description of the peripheral modules ADC, COMP, EXTI, DMA, FDCAN, FLASH, RCC, SPI, USB and others. There is a description of only HDMI_CEC, CR...

DPrid.1 · 2021-09-14

DPrid.1 · 2020-09-28

DPrid.1 · 2021-10-25

Find in https://www.st.com/resource/en/svd/stm32g0_svd.zipNew file STM32G0 System View Description 1.11 24 Aug 2021

DPrid.1 · 2021-09-15

This can be useful when the LQFP chip is located on the lower layer, and the upper layer is active. For BGA chips, footprint flip is available.

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STM32G0B1 MCU, System Viewer file STM32G0B1.SVD does not contain a description of the peripheral modules ADC, COMP, EXTI, DMA, FDCAN, FLASH, RCC, SPI, USB.

Why STM32CubeMX buttons flip horizontal and flip vertical inactive for LQFP package? Active for BGA package.

Where can I get PowerSSO-36 topside marking for the STA333W Amplifier Chip? Date production code?

Re: STM32G0B1 MCU, System Viewer file STM32G0B1.SVD does not contain a description of the peripheral modules ADC, COMP, EXTI, DMA, FDCAN, FLASH, RCC, SPI, USB.

Re: Why STM32CubeMX buttons flip horizontal and flip vertical inactive for LQFP package? Active for BGA package.