Hello,
I am currently designing a custom PCB with the STM32WLE5CC (QFN package) targeting +22 dBm in the 868 MHz frequency band.
I have been following the reference design based on the MB1720 board, which is specifically described as being for +22 dBm at 868 MHz. However, I don’t fully understand why, in this high-power configuration, the solder bridge for RFO_LP is closed while RFO_HP is left open.
Could you please clarify the reason for this choice in the reference design?
Thank you in advance.
