2021-04-14 01:06 PM
I am working with the stm32f407igh6 and need to account for timing in my layout. I have been unable to find documentation regarding the wire bond lengths inside the BGA. Are all the line lengths in side tis BGA the same length?
2021-04-14 02:21 PM
I don't know the answer but probably no. BGA (and WLCSP) are not wire-bonded; rather, there's a redistribution layer between the chip itself and the outward balls. Think of a thin PCB.
Please note that this is a primarily user-driven forum, with only casual ST presence. For answer of such a specific question, you might need to contact ST directly, through FAE or web support form.
JW