2024-09-05 12:00 PM
I have a pile of boards with STM32F303RCT7 MCU that are pulling a ton of current, i.e. they are fried.
I tried VI curve analysis but I'm not finding anything that leads me to why they blew up.
Can anyone suggest a good failure analysis lab that I can send the dead parts to?
2024-09-05 12:39 PM
Perhaps you can connect with your local support office, or FAE, to review your design and it's vulnerabilities.
Most likely due to conduction paths you've created through the IC and it's pins, and external circuits you've connected things too.
Look at supplies and LDO pins.