hello：I would like to ask about the specific meaning of the Revision code silkscreen on this chip.During the purchase, I found that the silk screen has 2.3.X etc.I want to know the difference between these chips . Best regards Sun

[孙辰.1]

And whether it has an impact in use.

[Tesla DeLorean]

Nobody here knows what chips you're talking about.

Try specifying full part numbers, and perhaps have large clear pictures of the parts and markings you're talking about.​

[孙辰.1]

Sorry,Chip is STM32F103.​

[Tesla DeLorean]

Ok, but still not clear on 2.3.x marking you talk about. Sounds like a code load added to a part by distributor, customer or custom manufacturer.

Most marks are lasered, not silk screened.

Take a photo, large resolution, clear and in focus.​

[孙辰.1]

OK, thanks. These are the two chips I saw, one X and one 2.

[孙辰.1]

[Tesla DeLorean]

Ok, that should reflect the chip revision / die stepping

It should be readable via an DBGMCU register

The features and issues of give versions should be covered in the Errata documents.

https://www.st.com/resource/en/errata_sheet/es0340-stm32f101xcde-and-stm32f103xcde-highdensity-device-limitations-stmicroelectronics.pdf

[孙辰.1]

Thank you for your reply. You are my lucky star.Now I am going to find the answer in the documentation.

[Tesla DeLorean]

How this impacts your design and software will depend on the peripheral usages, and coincidence with the errors/bugs in each of the respective IC design changes.

Generally ST has been very good at keeping these to a minimum, or hiding the impact in the SPL/HAL library implementations.

You'll need to go through the list, determine what might be impactful, and test/evaluate in your implementation.

This is likely to be a particular issue currently as anyone with old or surplus stock of parts is likely to be selling those via brokers, etc, leading to a random mix, rather than the freshest version of the part straight out of the fab.

[孙辰.1]

Thanks again for your reply to my question.