2023-09-07 06:24 AM
2023-09-08 09:15 AM - edited 2023-09-12 11:06 AM
Hello bsauze,
Your inquiry has been escalated to the online support center for direct support.
Should anyone else have a question on device package information in the future, please submit your support requests to https://my.st.com/ols
Kind Regards,
Christian
ST Support
2023-09-08 09:18 AM
2023-09-08 09:36 AM
Perhaps there have been changes since then.
I created a 48 pin UFQFPN PCB for L5xx with pads extended a bit outside the package, then hand soldered the flanks with a 1/8" chisel tip and liquid flux. That worked well as a prototype. For qual testing and production robots, solder paste and reflow ovens are probably the method of choice.
2023-09-08 10:01 AM
>>Perhaps there have been changes since then.
Perhaps, but there's been no follow up. Used 20, 28, and 32 pin UFQFPN here for their compact size, and production's dislike of WLCSP
Would have liked to see 20-pin UFQFPN for the C0 and G0's, but suspect the die's too big.