STM32H753 TFBGA240+25 SMT Assembly Instructions

[Yan Rosh]

Hello,

We are building a board with with the STM32H753XI (TFBGA240+25 package).

The assembly house for the PCB has notified us that the land pattern suggested in the datasheet is not complaint with IPC standards.

I was unable to find any assembly recommendation for this type of package, is there any information I can send to the assembly house?

Are there any special layout instructions for this part not specified in the datasheet?

Thanks,

Yan

[waclawek.jan]

This is a primarily user-driven forum, so it's unlikely you'll get relevant response on such a specialized question here. Contact ST directly, either thruogh FAE or through the web support form.

JW

[Yan Rosh]

Thanks for the advice, I'll try to contact them directly...

I was assuming that someone here made a board with this package and might have some useful information 🙂

Thanks,

Yan

[Khouloud GARSI]

Hi @Yan Rosh​ ,

As suggested by Jan, please contact your FAE or a local ST sales representative from the list indicated at this Link:

https://www.st.com/content/st_com/en/contact-us.html

Khouloud.

[Tesla DeLorean]

What's there specific complaint?

Pad size?

Solder Mask?

Via in Pad?

I'm not using this BGA, but have used similar things in the past. Manufacturing can't deal with divots in the pads, so screened on fill is a problem, the board needs to be planarized.