Thermal Characteristic of LDO

royS7 · ‎2023-11-01

The thermal characteristics of the LDL112PU33R show the junction to ambient thermal resistance (JA) and the junction to case thermal resistance (JC). However, the junction to board thermal resistance (JB) is missing. We need this characteristic for thermal simulation of the component on a board. Can anyone provide it or provide the necessary resources?

Thanks.

Peter BENSCH · ‎2023-11-01

Welcome @royS7, to the community!

Rthjc is the thermal resistance from the chip to the board. For DFN and PPAK, this refers to the metal underside (slug), for SO8 to the pins. Rthjc is usually sufficient for thermal simulation.

Hope that helps?

Regards
/Peter

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Peter BENSCH · ‎2023-11-01

Welcome @royS7, to the community!

Rthjc is the thermal resistance from the chip to the board. For DFN and PPAK, this refers to the metal underside (slug), for SO8 to the pins. Rthjc is usually sufficient for thermal simulation.

Hope that helps?

Regards
/Peter

In order to give better visibility on the answered topics, please click on Accept as Solution on the reply which solved your issue or answered your question.

royS7 · ‎2023-11-01

Could we consider Theta(JC) = Theta(JB) in this case?

Peter BENSCH · ‎2023-11-01

Yes, in your case you can set Theta(JC) = Theta(JB).

Good luck!
/Peter

In order to give better visibility on the answered topics, please click on Accept as Solution on the reply which solved your issue or answered your question.