2024-01-26 09:48 PM - last edited on 2024-03-01 05:38 AM by Peter BENSCH
Dear Sir/Madam,
We are planning to use this SCTHS300N75G3AG Sic MOSFET In our design.
We are not having any clarity on this component regarding to how much Copper thickness is required for this component and how to solder this component on the PCB and how we place Heat sink and all those details we need to know.
Please provide the information.
2024-01-26 09:51 PM
If anybody already used this component, please provide the Images for our reference which is help us for Analysis.