I am planning to replace a faulty PM8803 POE SMD. I have never dealt with pads and fill areas before, so apologies for what is probably an incredibly basic question.
The layout guidelines say:
"The exposed pad of the PM8803 must be connected to VSS: design a fill area with at least 6 vias to VSS plane. Try, where possible, to increase the number of VSS power planes connected, at least below the PM8803 position, to improve the heat dissipation of the PM8803."
Am I correct that this means that when I install the new device, the pad on the underside needs to be thermally and electrically connected to a pad (or a number of exposed vias) that I will find on the pcb when I remove the faulty one? That being the case, once I have removed the faulty device do I simply put some conductive paste/adhesive on the pad of the new device before positioning it on the board and soldering the pins?
