Hi,
I'm planning to use STBC15LQ in a design, but I'm finding some contradictions between STM's AN4208 (an application note about flip chip bonding) and a very brief recommended footprint in the STBC15LQ datasheet.
Can someone verify that the footprint in the datasheet will work, even though it deviates so significantly from the application note? Also, what should the soldermask opening be? it isn't specified in the datasheet.
Also - if the recommendations in AN4208 are followed, there will be some very small islands of solder mask underneath the chip. I need to route pin C2 to pin C1, will it be safe to do this even if there is no solder mask under the chip? I'm concerned about a mask-less trace wicking away solder from pin C2.
Thanks,
John
