SPWF01SA PCB Footprint

toby · ‎2015-11-17

Posted on November 17, 2015 at 15:05

Between the rev 4 & Rev 6 datasheets there seems to have been a change in the centre pad size on the recommended footprint. It now seems to ask for 8mm max x6mm max - previously it was specified as 10mmx8mm! I have based all my designs on the larger pad.

The datasheet revision history does not seem to mention this change. When did it come in? Has there been a revison change on the module?

#spwf01sa

Gerardo GALLUCCI · ‎2015-11-17

Posted on November 17, 2015 at 15:43

Hi Toby,

changes took place in Rev5.

Module's HW did not change. I mean, there was only a mismatch on picture number 7. Pad size was (and is still) 8x6mm.

Normally solder paste takes 80% of pad layout. You can reduce this percentage to 60%.

Regards

jerry

toby · ‎2015-11-17

Posted on November 17, 2015 at 15:53

Ok thanks for the info. I will have to update my footprint to match for the next production boards.

Unfortunately then I assume that then there is potentially a risk of shorts then with the larger pad and our current production assemblies?

Gerardo GALLUCCI · ‎2015-11-17

Posted on November 17, 2015 at 16:03

Within 60% there are no risks, because of solder resist (vias are ok)