For TSV324IDT it is MSL 1, but if our product engineer insists on baking the parts, how should we bake for the conditions? Or it is not advisable to bake since it is MSL 1 and not required baking as per ST recommendation?

[Peter BENSCH]

Welcome, @Teressa Loh​, to the community!

Floor Life is the time within which safe processing is possible without further baking in a realistically defined room climate. With MSL1, this Floor Life is not limited, so baking is not necessary.

Rough rule: the flatter a case is, i.e. the thinner the molding layer above the chip, the greater the risk of cracks due to the popcorn effect. With the TSC324IDT in SO8, this danger is very low.

Does it answer your question?

Regards

/Peter

[Teressa Loh]

Hi Peter,

Thank you for the explanation.

If product engineer still insisted on baking for this MSL 1 part, what kind of condition should they use?

Can they follow MSL 2 condition to bake the parts?

Regards,

Teressa

[Peter BENSCH · Accepted solution]

Yes, they can follow the conditions for MSL 2, but this is not necessary if the parts have been stored in a normal storage environment.

Further information for your device can be found e.g. in TN1224.

Good luck!

If the problem is resolved, please mark this topic as answered by selecting Select as best under your preferred answer. This will help other users find that answer faster.

/Peter

[Teressa Loh]

Thanks Peter... Have a great day.