About jeff

jeff · 2014-04-16

Posted on April 17, 2014 at 00:24Hi I have a question concerning the PCB routing of the TS4621ML headphone amplifier in 400um flip-chip package. I have the STEVAL-CCA025V1 demoboard for the TS4621E part and looking at the gerber files for it it app...

jeff · 2014-04-24

Posted on April 25, 2014 at 00:49Zhao Yun,Hi, I finished the layout for this board and followed your recommendations for the breakout of the inner pads of the 400 um bga however I think they are too large.If you look at the screenshot, number 3 is y...

jeff · 2014-04-18

Posted on April 18, 2014 at 17:08Zhao Yun,Thank you very much for the recommendations. I'm glad to hear I can avoid using micro vias with this part to save cost. I appreciate your help.Jeff

jeff · 2014-04-17

Posted on April 17, 2014 at 11:50Zhao Yun,Thanks for the reply. I've read that app note and it doesn't really give any routing guidelines for the inner balls other then suggestion using micro vias as an ''alternative''.I'm mainly wondering what was...

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PCB routing of inner balls for 400um flip-chip package on TS4621ML

Re: PCB routing of inner balls for 400um flip-chip package on TS4621ML

Re: PCB routing of inner balls for 400um flip-chip package on TS4621ML

Re: PCB routing of inner balls for 400um flip-chip package on TS4621ML