In the documentation for STM32WB09 it is written that the output impedance of the chip is 40 ohms. It is also written in the document AN5526 on page 5. And in the documentation for MLPF-NRG-01D3 chip it is written: Transmission line between STM32 and MLPF is dimensioned to 57 ohms characteristic impedance.
What should be the impedance of the transmission line between STM32 and MLPF?
And another question, in the same AN5526 document it says that the thickness of the double layer PCB should be 0.5mm.
At the same time there is a two-layer board STEVAL-IDB012V1. Does it really have a board thickness of 0.5mm? If the thickness is 1.5mm, can 1.5mm boards be used with the STM32WB09 chip?
