In DS10639 P105 [6.3.10 internal clock source characteristics], regarding the measurement conditions of TA (ambient temperature) described in Table 41:
- Is the measurement method of TA (ambient temperature) based on the temperature of a thermostatic chamber, or is it the temperature measured at a fixed measurement position? If it is the temperature measured at a fixed measurement position, please provide the distance from the CPU to the measurement position.
- What is the operating time at the ambient temperature being checked? (e.g., measuring drift after operating at 80°C for 2 hours)
Could you provide data equivalent to Figure 1 in AN5076 P6 [2.2 Drift of internal oscillator before and after reflow] for the CPU "STM32F446ZCJ" being used?
In AN5076 P8 [3.1 Thermal effects], the fifth line states "(The frequency may increase, but this is rare)", but in Figure 1 of AN5076 P6 [2.2 Drift of internal oscillator before and after reflow], it appears that the frequency generally drifts in the direction of increasing. Please confirm if the description in [3.1] is correct, as there seems to be a discrepancy.
When the CPU is mounted on a board and stored for a long period, does the internal CLOCK drift? If drift occurs, to what extent (percentage) does it drift?
