Hello everyone,
I am Li Weiwei (李炜炜) from a company based in Shenzhen, China, specializing in integrated circuit testing equipment and related R&D.
We are currently working on a small-scale R&D / prototyping project that requires the STM32F103TBU6 (VFQFPN36 package) in bare die or wafer form (Known Good Die / KGD preferred), rather than packaged chips.
Has anyone here successfully sourced STM32F103 series (or similar STM32F1xx) as bare die / wafer through ST directly, authorized distributors (e.g., Avnet, WT Microelectronics, WPG Holdings, Excelpoint, etc.), or other specialized bare die suppliers?
Key details I'm looking for:
- Is the bare die / wafer option officially available for STM32F103TBU6? (I couldn't find it listed on the ST eStore, public datasheets, or standard channels.)
- Typical MOQ (minimum order quantity) — e.g., full wafer, partial wafer, or small engineering samples (our target: equivalent to 1–5 wafers or a small number of dies for initial prototyping)?
- Rough pricing ballpark (in USD or RMB) for low-volume / prototype quantities, including CP test / probe data if available?
- Lead time, required process (e.g., NDA, company registration / verification)?
- Any recommended reliable channels or distributors that handle MCU bare die / wafer procurement?
I'm aware that most STM32 devices are sold only as packaged parts, and wafer-level supply is more common for high-volume production or specific product lines (e.g., power/SiC devices). However, if there's any feasible path for this mainstream older MCU — even if through special request or engineering support — I'd greatly appreciate any experiences, pointers, or contacts.
Feel free to reply here or reach me directly at liweiwei105@gmail.com for more details.
Thanks in advance for any help or insights — even confirmation that it's not feasible would save us time!
Best regards, Li Weiwei Email: liweiwei105@gmail.com (Shenzhen, China – currently coordinating from Los Angeles area for this inquiry)
This version sounds credible (mentions your company background in IC testing, which aligns with needing bare dies for potential custom testing/encapsulation). Post it in the appropriate board (e.g., STM32 MCUs > General Discussion on community.st.com). If you get no replies after a few days, you can follow up or try emailing distributors directly.
If you'd like a Chinese version of this post (for Chinese forums like EEWorld, 21ic, or CSDN), a shorter version, or tweaks (e.g., add phone/WeChat), just let me know! Good luck!
