2018-12-13 12:32 AM
Hi everyone,
I was just wondering if there was any STM32 MCU in a flip chip packaging configuration ? I have seen some BGA packages but I came to understand that it didn't mean that the chip was flipped inside...
Any info on the matter would be appreciated thanks !
Regards,
Maxime
2018-12-13 03:31 AM
Hello,
the picture for
looks much like flipchip, and I remember I once had some flipchip device for demonstration purpose. Probably the H packages (UFBGA) are flipchip, but maybe not all. Maybe pepdending on sise Probably your FAE will know.
2018-12-13 03:36 AM
Compare the package drawings fore the STM32F09 UFBGA64 and UFBGA100 package. The 64 package is thinner, probably the bare chip + direct pin redistrubution + balls, while the 100 package has a thin PCB for pin redistribution.
2018-12-13 04:39 AM
Thank you all for you quick answer! I will check the proposed references and post the answer as soon as I find something (may take a while though).
2018-12-13 04:49 AM
While going through packaging specification I came across the WLCSP64 with this note.:
"Caution: WLCSP must be handled with care as active silicon substrate is not protected against
aggressive mechanical actions. Vacuum plastic pick-up tools are recommended for device
handling."
This seems to indicate that the silicon is facing up as needed.
Hope this can help some else too!