2025-05-26 3:17 AM - last edited on 2025-05-26 4:58 AM by Peter BENSCH
Dear ST Support Team,
We are using the L9678P in an automotive design where the battery voltage is nominally 28 V.
From the datasheet, we understand the following for the VBATMON pin:
Absolute maximum voltage: 40 V
Operative maximum voltage: 18 V
We would like to confirm:
Can VBATMON be directly connected to a 28 V rail continuously, or is this outside the safe operating range?
Is it mandatory to use a voltage divider to reduce VBATMON below 18 V during normal operation?
Is VBATMON used only for battery voltage monitoring, or does it have a role in powering internal logic?
Does VBATMON directly influence wake-up and shutdown behavior of the IC?
We want to ensure safe operation and avoid long-term reliability issues.
Thank you in advance.
Best regards,
Umesh
Solved! Go to Solution.
2025-05-27 8:04 AM - edited 2025-05-27 8:05 AM
Dear Umesh,
I belong to Application Team of Passive Safety group.
Here our feedbacks:
Yes, it is our suggestion to use a voltage divider.
VBATMON is used for power-up and power-down sequences, and ERBOOST enable.
It is also used to alarm the MCU in order to guarantee the correct functionality of RSU function.
2025-05-26 3:40 AM
You must use a resistive voltage divider to scale down your 28 V rail to a level within the recommended operating range of VBATMON (typically aiming for 12–16 V as a safe design margin). A buffer (e.g. op-amp or zener clamp) may also be considered depending on the precision and protection requirements.
For example, for 28 V nominal and 18 V max input:
Choose resistor values such that V_BATMON = 28 V × (R2 / (R1 + R2)) ≤ 18 V
This implies a ratio where (R2 / (R1 + R2)) ≤ 0.643
2025-05-27 8:04 AM - edited 2025-05-27 8:05 AM
Dear Umesh,
I belong to Application Team of Passive Safety group.
Here our feedbacks:
Yes, it is our suggestion to use a voltage divider.
VBATMON is used for power-up and power-down sequences, and ERBOOST enable.
It is also used to alarm the MCU in order to guarantee the correct functionality of RSU function.
2025-05-27 11:22 PM
Dear @ahsrabrifat and @MJP
Thank you both for your support and previous replies. As part of finalizing our thermal and power design around the L9678P, I would appreciate your confirmation on one last point regarding the VDD5 and VDD3V3 regulators:
Are the following maximum current values valid for continuous operation?
VDD5: 200 mA max (as per Table 36)
VDD3V3: 125 mA max (as stated in Section 4.3.5)
Are these values suitable for power loss and thermal dissipation calculations, especially for dimensioning the external pass transistor (for VDD5) and ensuring reliability over full temperature range?
Please confirm if any additional derating or application-specific guidance is recommended.
This will help ensure the safe sizing of our power path. Thanks again for your assistance.
Best regards,
Umesh
2025-05-28 9:31 AM
Dear Umesh,
Yes, you are right: the values you have reported (200mA for VDD5 and 125mA for VDD3V3) are the maximum ones for continuos operation.
These values are calculated to keep the junction temperature below 150 degrees
starting from a maximum ambient temperature of 95 degrees
and considering that all the functions reported in the datasheet are enabled and are working.
Of course, if in your application you don't use some functionalities, you can have a higher starting ambient temperature.
Kind regards,
Jonathan
2025-06-15 11:43 PM - edited 2025-06-16 12:21 AM
Dear @ahsrabrifat and @MJP ,
Thank you both for your support and previous replies.
We are currently finalizing our hardware design using the L9678P, with a focus only on deployment functionality and functional safety compliance according to IEC 61508.
Our goal is to clearly identify:
(For communication, monitoring, wake-up, and control logic)
We believe the following pins are required — please confirm:
MOSI | SPI Master Out Slave In |
MISO | SPI Master In Slave Out |
SCK | SPI Clock |
CSN | SPI Chip Select |
WAKEUP | Wake-up input |
RESET | Reset output to MCU |
VDDQ | I/O voltage reference (tie to MCU logic level) |
ARM | Arming status output (optional for monitoring) |
We’ve identified the following as needing passives or control components:
VDD5, BVDD5 | |
VDD3V3 | |
VSUP, BVSUP | |
VER | |
ERBOOST | |
VSF | External FET drive (for safing) |
SS01, SS23 | Deployment outputs — any external components needed? |
VBATMON | |
COVRACT | For external crossover switch control |
ARM: Can this be left unconnected if not monitored by MCU?
WDT/TM: Marked "Not for application" – should it be pulled low, left floating, or tied to MCU?
SS01 / SS23: Are external components (e.g., resistors, capacitors, TVS) needed for these?
COVRACT: Required only for external crossover FETs, or also with internal ER switch? Is MCU control needed?
Is my understanding correct that uC_FLEN is a control signal from the MCU used to enable or disable the safing FET path (typically by pulling the gate low)?
What is the recommended driving strategy from the MCU for this pin?
Note: We are not using ISO9141 and the Remote Sensor Interface, so those pins are excluded.
Our use case is centered on deployment control and functional safety (IEC 61508), so we are only implementing what is essential for that scope.
Thank you again for your continued support.
Best regards,
Umesh
2025-06-17 2:32 AM - edited 2025-06-17 5:10 AM
Dear @ahsrabrifat and @MJP ,
As already asked in the previous post — and now clarified further as I’ve gone through the datasheet and functional descriptions in detail — I’d like to summarize the key points we’ve understood and kindly request your confirmation on the following items.
We are finalizing our hardware design using the L9678P, focused exclusively on deployment functionality in compliance with IEC 61508. Our use case does not include external sensors (i.e., no sensor data read in Safing State), and we are not using the Remote Sensor Interface or ISO9141 features.
Below is the list of pins we believe must be connected to the MCU for SPI communication, control logic, arming, and optional monitoring:
SPI_MOSI | SPI Master Out – data from MCU to L9678P |
SPI_MISO | SPI Master In – data from L9678P to MCU |
SPI_SCK | SPI Clock |
SPI_CS | SPI Chip Select |
RESET | System Reset – issued by MCU to initialize L9678P |
WAKEUP | Wake-up input – required only if low-power or sleep modes are used |
FENH | External arming enable for high-side drivers (active high) – used when no sensor input is available, and safing must be handled externally (since in safing State ARM and VSF won’t be valid figure. 9)
|
FENL | External arming enable for low-side drivers (active low) – also used when no sensor input is available, for the same reason as above |
ACL | Additional Communication Line – required to enter Arming State, as per ACLGOOD = 3 condition in Figure 9 |
uC_FLEN | In the reference schematic, uC_FLEN appears to be used as a GPIO from the MCU to control a FET in the VSF-powered safing path — is this correct? Could this function alternatively be driven by one of the L9678P’s GPO drivers to reduce MCU pin usage? (typically near U1 as shown in Figure 58) |
ARM | Arming status output – acts as a “ready-to-deploy” flag; can be monitored by the MCU or read via SPI |
VDDQ | Logic I/O reference – should be connected to MCU's I/O voltage supply to match logic levels |
Please confirm if the above list is sufficient and minimal for a deployment-only application using without sensors ( not reading any external sensor data) .
If needed, I can follow up with the external hardware-supported pins (power, filtering, energy reserve, etc.).
Thank you again for your continued support.
Best regards,
Umesh
2025-06-19 1:15 AM
Dear Umesh,
my feedbacks:
Kind regards,
Jonathan
2025-06-19 1:41 AM
Dear Umesh,
further feedbacks.
POINT 1
Reviewed in the other answer.
POINT 2
In Figure 2 and Figure 58 of DS11626 you can find the typical application that can help you in understanding what written above.
POINT 3
Kind regards,
Jonathan