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EP pin on L6924D

italoMoraes
Associate

Hi!

I'm using the L6924D chip for a university, and just saw a pin called EP. Searching on net, it is pointed that it's used for thermal purposes. Is that correct? If it is, what is the best approach for optimizing this parameter, considering the module will be confined in a box, inside another box?

Thank you in advance!

1 ACCEPTED SOLUTION

Accepted Solutions
TDK
Guru

EP stands for Exposed Pad, which is used to improve thermal performance. This is common on many chips and generally it should be connected to GND. This chip is no exception:

TDK_0-1722891635692.png

 

There are guidelines given in the datasheet. Basically, it should be well connected to a large ground plane which acts as a heat sink.

If you feel a post has answered your question, please click "Accept as Solution".

View solution in original post

1 REPLY 1
TDK
Guru

EP stands for Exposed Pad, which is used to improve thermal performance. This is common on many chips and generally it should be connected to GND. This chip is no exception:

TDK_0-1722891635692.png

 

There are guidelines given in the datasheet. Basically, it should be well connected to a large ground plane which acts as a heat sink.

If you feel a post has answered your question, please click "Accept as Solution".