My team and I have been working on the design of a radio module using the STM32WLx5 MCU. To simplify the RF front end, we decided to go with the BALFHB-WL-02D3.
In the BALFHB-WL-02D3 Datasheet, the below mentioned board stack-up is recommended for the best RF performance. This stack-up comes up to a 1.085mm board thickness (which is non-standard)
We had a few questions on the stack-up:
- Our local manufacturer had some issues while manufacturing the desired board thickness. What would be the effect on the RF performance if we were to use a standard 1mm / 1.2mm board thickness (details below)?
- We are also looking forward to using the Rogers PCB Substrate (RO4003C, RO4350B etc). As the dielectric constants of FR4 and RO has a drastic difference, the RO board stack-up should be significantly different. What would be the dimensions if we were to use a Rogers Laminate as the Prepreg?
Thanks,
MoralkaraLynn
