I need to reball a FLI32626H that is clearly presenting soldering issues. One can see the chip is tilted with the naked eye. It has been reflowed twice to no avail.
According to ST support, this is a legacy product, and ST no longer has technical resources for supporting this product. No support to legacy, that is truly a regrettable approach.
So can you please inform the correct size and dimensions of soldering ball and temperature profile for this package?
Here its datasheet: https://www.st.com/resource/en/data_brief/fli32626h.pdf
And product's website: https://www.st.com/content/st_com/en/products/touch-and-display-controllers/display-controllers/fli32626h.html
Also, googling PBGA 409 31x31x2.46 won't return any good info...
