2021-08-30 12:51 AM
2021-08-30 02:52 AM
Hi, being the ASM330LHH package the same as for example the LSM6DS3 one (LGA-14L (2.5 x 3 x 0.83 mm), https://www.st.com/resource/en/datasheet/lsm6ds3.pdf), you can use the SnapEDA free footprint:
--> https://www.snapeda.com/parts/LSM6DS3/STMicroelectronics/view-part/
There are also these guidelines to be taken into account while soldering the device:
\Dk
2021-08-30 02:52 AM
Hi, being the ASM330LHH package the same as for example the LSM6DS3 one (LGA-14L (2.5 x 3 x 0.83 mm), https://www.st.com/resource/en/datasheet/lsm6ds3.pdf), you can use the SnapEDA free footprint:
--> https://www.snapeda.com/parts/LSM6DS3/STMicroelectronics/view-part/
There are also these guidelines to be taken into account while soldering the device:
\Dk
2021-08-31 01:55 AM
Thanks for your fast answer!
I have another question about STA8100GA.
We would like to use it in our design, could you give me 3D drawing about it? (3DSTEP). It has LFBGA81 case.
Thanks,
Endre Maraz
2021-09-01 12:02 AM
Hi Endre Maraz @EMara.1 ,
Thank you for the feedback, and thank you \Dk @DSull.3 for your answer!
@EMara.1 , could you please post a new question for the STA8100GA in the GNSS positioning group? This will for sure broaden the potential help.
You can also select the as "Best" if this helped with your issue.
-Eleon