Browse
STMicroelectronics Community
FAQs
Sign In
Product forums
STM32 MCUs
STM32 MCUs Products
STM32 MCUs Boards and hardware tools
STM32 MCUs Software development tools
STM32 MCUs Embedded software
STM32 MCUs TouchGFX and GUI
STM32 MCUs Motor control
STM32 MCUs Security
STM32 MCUs Wireless
STM32 MPUs
STM32 MPUs Products
STM32 MPUs Boards and hardware tools
STM32 MPUs Embedded software and solutions
STM32 MPUs Software development tools
MEMS and sensors
MEMS (sensors)
Imaging (sensors)
Automotive and Transportation
Automotive MCUs
AutoDevKit Ecosystem
GNSS positioning
Edge AI
Analog and audio
Interface and connectivity ICs
Power management
ST25 NFC/RFID tags and readers
STM8 MCUs
Other: hardware
Other: software
Knowledge base
STM32 MCUs
STM32 MPUs
MEMS and sensors
Analog and audio
EMI filtering and signal conditioning
Interface and connectivity ICs
Power management
Quality & reliability
Academy
About
Community guidelines
Feedback forum
Community blog
Developer news
Colin Greenfield
Associate
since
2023-08-29
2023-08-29
User statistics
1
Posts
0
Solutions
0
Kudos given
0
Kudos received
View all badges
STMicroelectronics Community
About Colin Greenfield
Options
Report User
User Activity
Posts
Replies
Solder paste printing recommendations for POWERSTEP01
2023-08-29
Is there anywhere I can find the solder paste recommendations for the POWERSTEP01? The footprint appears complex and we would like guidance on the recommended solder paste deposit sizes and stencil thickness for production assembly purposes.
No replies to display.