Browse
STMicroelectronics Community
FAQs
Sign In
Product forums
STM32 MCUs
STM32 MCUs Products
STM32 MCUs Boards and hardware tools
STM32 MCUs Software development tools
STM32 MCUs Embedded software
STM32 MCUs TouchGFX and GUI
STM32 MCUs Motor control
STM32 MCUs Security
STM32 MCUs Wireless
STM32 MPUs
STM32 MPUs Products
STM32 MPUs Boards and hardware tools
STM32 MPUs Embedded software and solutions
STM32 MPUs Software development tools
MEMS and sensors
MEMS (sensors)
Imaging (sensors)
Automotive and Transportation
Automotive MCUs
AutoDevKit Ecosystem
GNSS positioning
Edge AI
Interface and connectivity ICs
Power management
ST25 NFC/RFID tags and readers
STM8 MCUs
Others: hardware and software
Analog and audio
Knowledge base
STM32 MCUs
STM32 MPUs
MEMS and sensors
Analog and audio
EMI filtering and signal conditioning
Interface and connectivity ICs
Power management
Quality & reliability
Academy
About
Community guidelines
Feedback forum
Community blog
Developer news
raghava235
Associate
since
2023-07-11
2025-01-05
User statistics
1
Posts
0
Solutions
0
Kudos given
0
Kudos received
View all badges
STMicroelectronics Community
About raghava235
Options
Report User
User Activity
Posts
Replies
SIC mosfet die dimensions for thermal simulation.
2023-07-11
Hai we are currently interested in using the SCT055HU65G3AG and SCT018H65G3AG in HU3Pak. Can you please provide the die dimensions and reference for thermal simulation of these packages. Thank you.
No replies to display.