Is there a good resource for understanding the differences with UFQFPN vs UFBGA? I would like to know the pros and cons with each and when to use one versus the other.

[Sco]

The size of a BGA package is always smaller, and the path of signals could be shorter, it is good for the performance. But with a BGA package, the component is harder to reuse... before reusing it, you need some tools to handle the component, like Reballing.

[Tesla DeLorean]

The escape is more complicated, via-in-pad also requires more expensive finishing processes, ie fill and planarization

You should probably discuss with your manufacture/assembly people, and also determine acceptable board costs/expectations.