Documentation of STM32WB Bluetooth® Low Energy (BLE) wireless interface
I'm trying to find a proper documentation for the ACI commands of the bluetooth stack included in the STM32CubeWB MCU Firmware Package. We're running the stm32wb5x_BLE_Stack_full_fw on one CPU of a WB55 and our application on the other. Our application uses the STM32_WPAN middleware (e.g. functions from ble_gap_aci) to control the stack. I miss a proper documentation of these functions. What values can `aci_gap_remove_bonded_device` possibly return?
So far I had a look at The BlueNRG-MS Bluetooth® LE stack application command interface (ACI), the STM32WB Bluetooth® Low Energy (BLE) wireless interface and of course the Building wireless applications with STM32WB Series microcontrollers. None of these documents contained a description of the individual return values.
