Hallo, I have a question for the STM32L151 in the UFGBA100 package.
There is a technical note for the WLCSP-package existing (TN1163). In this note it is not recommended to clean the WLCSP package and also apply no ultrasonic cleaning methods.
We are using the UFBGA100 package. I cannot find any recommendations for this package how to clean them on an assembled board. In the application note AN2639 reflow recommendations are given and in figure 1 there is a hint for cleaning, but no further details are given.
As I suspect the UFBGA100 is similar to the WLCSP package in case of size, balling and construction.
Does anyone has experience or see a risk of cleaning the UFBGA100 package in ultrasonic processes?
